11007B Series
High Temperature Compliance
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Produktinformation
| Category | Board to Board Connectors |
| Series | 11007B Series |
Detailinformationen
| Connecting Type | Socket |
| Mating Interface | Stacking |
| Contact Direction | |
| Pitch | 0.4 mm |
| Pin Counts | |
| Plating Thickness | 0.1 μm Min. |
| Signal Transmission Speed | |
| Width (Depth) | 3.1 mm |
| Rated Voltage (AC) | 125 V |
| Rated Current | 0.4 A |
| Impedance Matching | 100 Ω |
| Operating Temperature Range (Max.) | +125 ℃ |
| Array | Dual Row |
| Halogen Free | No |
| 2-Point Contact | No |
| Ground Terminal | No |
| Tape | No |
| Y-Axis Floating Range | 0 |
| Amplitude | |
| Card (FPC) Retention Mechanism | |
| Package Quantity | 1800 |
| PCB Mounting Methods | SMT |
| Connector Orientation | Vertical |
| Mating Direction | TopEntry |
| Solder Tail Pitch | 0.4 mm |
| Contact Plating | Gold |
| Signal Spec | |
| Length (Pitch Direction) | |
| Height | |
| Rated Voltage (DC) | 50 V |
| Withstand Voltage | 100 V (AC) |
| Contact Resistance | 100 mΩ Max. |
| Operating Temperature Range (Min.) | -40 ℃ |
| RoHS2 | Yes |
| Floating | |
| Boss Locator | No |
| Cap | Yes |
| X-Axis Floating Range | 0 |
| Effective Wiping Length | 0.3 |
| Durability | 30 |
| Packaging Type | Emboss |
